We will exhibit at SEMICON Japan 2021.

Period: December 15 (Wed) – December 17 (Fri)
Venue: Tokyo Big Sight East Exhibition and Conference Building No.4035
　　　　　〒135-0063 3⁻10⁻1 Ariake, Koto-ku, Tokyo

Exhibitors:
　　　　Edge, front and back side composite inspection equipment AXM Series [New product]
　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　　 RXM Series
　　　　Device Wafer Back Inspection Equipment BMW Series
　　　　Wafer Edge Defect Inspection Equipment RXW Series

We would like to invite you to come by all means.

▼Click here for details of the exhibition
https://www.semiconjapan.org/jp/