We will exhibit at SEMICON Japan 2023.

Period: December 13 (Wed) – December 15 (Fri)
Venue : Tokyo Big Sight East Exhibition Halls and Conference Tower No.6632
　　　　 3-11-1 Ariake, Koto-ku, Tokyo-to 135-0063 Japan
Exhibitors:
　　　　Edge, front and back side composite inspection equipment – AXM Series / RXM Series
　　　　Device Wafer Back Inspection Equipment – BMW Series
　　　　Wafer Edge Defect Inspection Equipment – RXW Series

We are looking forward to seeing you.

▼Click here for details of the exhibition
https://www.semiconjapan.org/en/